Text Box: Improving SMT PCBA Process Duration : 2 days Venue :   Evergreen Laurel Hotel, Penang   Towards high reliability and quality SMT Manufacturing  SBL Khas . 100% claimable.                                                      Course Contents :  1.  SMT Process and Components understanding 2.   Advanced packages, CSP, Flip Chip Assembly Process.  3.   PCB substrate variables and compositional Analysis   4.   Troubleshooting Solderability problems  5.   Solder joints reliability, intermetallic and microstructures  6.   Lead Free vs leaded soldering  7.   Solder paste selection and its relation to reflow soldering  8.   Solder paste printing process parameters  9.   Stencil design, its impact on manufacturability and reliability  10. Reflow soldering, profile implication and optimisation  11. Board Testing and AOI  12. Process Clinic, discussion on possible causes/Solution